{"title":"Applying Anand versus Garofalo creep constitutive models for simulating sintered silver die attachments in power electronics","authors":"Mohammad A. Gharaibeh, J. Wilde","doi":"10.1177/03093247231190449","DOIUrl":null,"url":null,"abstract":"This paper aims to examine the thermomechanical response of sintered silver die attachments in power electronics using finite element analysis (FEA). In this work, several material parameters of the sintered silver bonds are investigated. Additionally, two common solder creep constitutive laws including Anand and Garofalo models are also studied. To ensure the fidelity of the simulation procedures, the finite element (FE) models are first correlated with digital image correlation data. Afterward, the FE models are utilized to examine the influence of the material and creep models on the die attach stresses, strains, and plastic works. The expected fatigue and lifetime predictions of the sintered silver layer are thoroughly discussed, accordingly. The results proved that the die attach layer mechanical response is highly driven by the material parameters and creep modeling procedures considered throughout the simulations. Thus, the resulting fatigue life is evaluated. Finally, a general modeling guideline for simulating thermomechanical response of sintered silver die attachments in power electronics are provided in great detail.","PeriodicalId":1,"journal":{"name":"Accounts of Chemical Research","volume":null,"pages":null},"PeriodicalIF":16.4000,"publicationDate":"2023-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Accounts of Chemical Research","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1177/03093247231190449","RegionNum":1,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This paper aims to examine the thermomechanical response of sintered silver die attachments in power electronics using finite element analysis (FEA). In this work, several material parameters of the sintered silver bonds are investigated. Additionally, two common solder creep constitutive laws including Anand and Garofalo models are also studied. To ensure the fidelity of the simulation procedures, the finite element (FE) models are first correlated with digital image correlation data. Afterward, the FE models are utilized to examine the influence of the material and creep models on the die attach stresses, strains, and plastic works. The expected fatigue and lifetime predictions of the sintered silver layer are thoroughly discussed, accordingly. The results proved that the die attach layer mechanical response is highly driven by the material parameters and creep modeling procedures considered throughout the simulations. Thus, the resulting fatigue life is evaluated. Finally, a general modeling guideline for simulating thermomechanical response of sintered silver die attachments in power electronics are provided in great detail.
期刊介绍:
Accounts of Chemical Research presents short, concise and critical articles offering easy-to-read overviews of basic research and applications in all areas of chemistry and biochemistry. These short reviews focus on research from the author’s own laboratory and are designed to teach the reader about a research project. In addition, Accounts of Chemical Research publishes commentaries that give an informed opinion on a current research problem. Special Issues online are devoted to a single topic of unusual activity and significance.
Accounts of Chemical Research replaces the traditional article abstract with an article "Conspectus." These entries synopsize the research affording the reader a closer look at the content and significance of an article. Through this provision of a more detailed description of the article contents, the Conspectus enhances the article's discoverability by search engines and the exposure for the research.