Effect of Annealing on Resistive Switching Behavior of PMMA Based RRAM

Ishan Varun, Deepak Bharti, A. Mahato, Vivek Raghuwanshi, S. P. Tiwari
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引用次数: 1

Abstract

A PMMA based Ag/PMMA/Ti/Glass RRAM devices are reported for their resistive switching behavior. Switching performance was tested on three samples fabricated at different PMMA annealing temperatures. The switching voltages have shown a down trend with increasing annealing temperature. The Current on/off ratio and retention time also degrades with annealing temperature. The devices exhibited significantly low switching voltages (<1 V) and retention time upto 103 s. Annealing of PMMA at higher temperatures may result in softening of films resulting in lower switching voltages due to defects generation and easy charge migration. The conduction mechanism has been investigated by double log plot of I-V characteristics of device suggesting ohmic conduction at lower voltages in in HRS and in LRS. At higher voltages in HRS, space charge limited conduction dominates the conduction mechanism.
退火对PMMA基RRAM阻性开关性能的影响
报道了一种基于PMMA的Ag/PMMA/Ti/玻璃RRAM器件的电阻开关特性。测试了在不同退火温度下制备的三种样品的开关性能。开关电压随退火温度的升高呈下降趋势。电流通/关比和保持时间也随退火温度的升高而降低。该器件具有显著的低开关电压(<1 V)和保持时间长达103 s。PMMA在较高温度下的退火可能导致薄膜软化,从而由于缺陷的产生和易于电荷迁移而降低开关电压。通过双对数图研究了器件的I-V特性,表明在低电压下HRS和LRS的欧姆传导机制。在高压下,空间电荷限制的传导机制占主导地位。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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