{"title":"A highly-sensitive and highly-integrated flexible broadband imager with 3D printed $\\pi$-shaped photo-thermoelectric pixel structures","authors":"Kou-Tan Li, R. Utaki, Meiling Sun, Y. Kawano","doi":"10.1109/IRMMW-THz46771.2020.9370813","DOIUrl":null,"url":null,"abstract":"To push forward existing multi-functional terahertz (THz) imaging applications, such as flexible and broadband operation with carbon nanotube (CNT) film-based photo-thermoelectric (PTE) imagers, the high-density pixel integration is essential. This paper proposes a fusion between CNT film absorbers and easily printable flexible thermoelectric modules (TEGs) to design a highly-sensitive, highly-integratable, three-dimensional $\\pi$-shaped PTE pixel structure. A simple transfer printing enables vertical alignment of Bi2Te3-based PN TEG pairs on a flexible substrate. The CNT film surface channel functions as the efficient heat transfer induced by the external THz irradiation to the vertical TEG structure.","PeriodicalId":6746,"journal":{"name":"2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)","volume":"17 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2020-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 45th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRMMW-THz46771.2020.9370813","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
To push forward existing multi-functional terahertz (THz) imaging applications, such as flexible and broadband operation with carbon nanotube (CNT) film-based photo-thermoelectric (PTE) imagers, the high-density pixel integration is essential. This paper proposes a fusion between CNT film absorbers and easily printable flexible thermoelectric modules (TEGs) to design a highly-sensitive, highly-integratable, three-dimensional $\pi$-shaped PTE pixel structure. A simple transfer printing enables vertical alignment of Bi2Te3-based PN TEG pairs on a flexible substrate. The CNT film surface channel functions as the efficient heat transfer induced by the external THz irradiation to the vertical TEG structure.