Ultra-Compact and Modular 5G Phased-Array 4-Channel Beamformer Front-Ends with <2° RMS Phase Error

T. Kanar, S. Zihir, N. Yanduru
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引用次数: 9

Abstract

This paper presents the state-of-the-art millimeter wave IC development for 5G communication systems in various frequency bands. 2×2 TRX beamformer IC's at 26, 28 and 39 GHz achieve <2° RMS phase error, high channel-to-channel isolation, low-power consumption (<250 mW in TX and <200 mW RX modes, per channel), and include fast T/R switching (<100 ns), 4-level fast phase and gain weighting memory access (<30 ns) and temperature reporting. Ultra-compact IC's enable low-cost panel implementations as well as modular and cost effective system-in-package (SiP) solutions for 5G flat panel phased array systems.
超紧凑型和模块化5G相控阵4通道波束发生器前端,相位误差<2°RMS
本文介绍了5G通信系统中各频段毫米波集成电路的最新发展。2×2 TRX波束形成器IC在26,28和39ghz实现<2°RMS相位误差,高通道到通道隔离,低功耗(<250 mW在TX和<200 mW RX模式,每通道),并包括快速T/R切换(<100 ns), 4级快速相位和增益加权存储器访问(<30 ns)和温度报告。超紧凑型集成电路为5G平板相控阵系统提供了低成本的面板实现以及模块化和经济高效的系统级封装(SiP)解决方案。
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