{"title":"Ultra-Compact and Modular 5G Phased-Array 4-Channel Beamformer Front-Ends with <2° RMS Phase Error","authors":"T. Kanar, S. Zihir, N. Yanduru","doi":"10.1109/MWSYM.2018.8439596","DOIUrl":null,"url":null,"abstract":"This paper presents the state-of-the-art millimeter wave IC development for 5G communication systems in various frequency bands. 2×2 TRX beamformer IC's at 26, 28 and 39 GHz achieve <2° RMS phase error, high channel-to-channel isolation, low-power consumption (<250 mW in TX and <200 mW RX modes, per channel), and include fast T/R switching (<100 ns), 4-level fast phase and gain weighting memory access (<30 ns) and temperature reporting. Ultra-compact IC's enable low-cost panel implementations as well as modular and cost effective system-in-package (SiP) solutions for 5G flat panel phased array systems.","PeriodicalId":6675,"journal":{"name":"2018 IEEE/MTT-S International Microwave Symposium - IMS","volume":"186 1","pages":"1327-1329"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE/MTT-S International Microwave Symposium - IMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2018.8439596","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
This paper presents the state-of-the-art millimeter wave IC development for 5G communication systems in various frequency bands. 2×2 TRX beamformer IC's at 26, 28 and 39 GHz achieve <2° RMS phase error, high channel-to-channel isolation, low-power consumption (<250 mW in TX and <200 mW RX modes, per channel), and include fast T/R switching (<100 ns), 4-level fast phase and gain weighting memory access (<30 ns) and temperature reporting. Ultra-compact IC's enable low-cost panel implementations as well as modular and cost effective system-in-package (SiP) solutions for 5G flat panel phased array systems.