Evolution of viscoelastic behavior of a curing LY5052 epoxy resin in the glassy state

IF 1.8 Q3 ENGINEERING, MANUFACTURING
S. Saseendran, M. Wysocki, J. Varna
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引用次数: 23

Abstract

Abstract The aim of this work is to develop a methodology to analyze the influence of the curing history on the viscoelastic storage modulus. Two different experimental approaches are presented exposing the material to various cure temperature and cure time sequences. The evolving viscoelastic properties are characterized using standard Dynamic Mechanical and Thermal Analysis (DMTA) equipment. Therefore, the present study is limited to infinitesimally small strains and linear viscoelasticity only. The methodology is demonstrated using the LY5052 epoxy resin system for its storage modulus E′ in the frequency domain. Results indicate that evolution of thermo-viscoelastic properties could be indeed assumed independent of the cure history for the investigated LY5052. We observe that the shift factor in the reduced time expression for the viscoelastic model examined in this paper is a product of two shift functions, namely the temperature and cure shift functions.
固化LY5052环氧树脂玻璃态粘弹性行为演变
摘要本研究的目的是建立一种方法来分析固化历史对粘弹性储存模量的影响。提出了两种不同的实验方法,将材料暴露在不同的固化温度和固化时间序列中。采用标准的动态力学和热分析(DMTA)设备对其粘弹性特性进行了表征。因此,目前的研究仅限于无限小应变和线性粘弹性。该方法使用LY5052环氧树脂体系在频域的存储模量E '进行了演示。结果表明,LY5052的热粘弹性性能的演变确实可以假设独立于固化历史。我们观察到,本文研究的粘弹性模型的时间简化表达式中的位移因子是两个位移函数的乘积,即温度位移函数和固化位移函数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
CiteScore
4.00
自引率
0.00%
发文量
11
审稿时长
16 weeks
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