Dynamics of an Evaporating Drop Migrating in a Poiseuille Flow

IF 2.8 4区工程技术 Q2 ENGINEERING, MECHANICAL

Journal of Heat Transfer-transactions of The Asme Pub Date : 2023-07-19 DOI:10.1115/1.4063154

Anubhav Dubey, K. Sahu, Gautam Biswas

引用次数: 0

Abstract

The evaporation of a liquid drop of initial diameter (Ddrop) migrating in a tube of diameter (D0) is investigated using the coupled level set and volume of fluid (CLSVOF) method focusing on determining the heat and mass transfer coefficients for a deforming drop. A robust phase change model is developed using an embedded boundary method under a finite difference framework to handle vaporizing flows. The model is extensively validated through simulations of benchmark problems such as arbitrary evaporation of a static drop and reproduction of psychrometric data. The results show that the Sherwood number (Sh) and the Nusselt number (Nu) reach a steady value after an initial transient period for the drop subjected to Hagen-Poiseuille flow. A parametric study is conducted to investigate the effect of drop deformation on the rate of evaporation. It is observed that Stefan flow due to evaporation has a negligible impact on the drop deformation dynamics. We also observed that, for different values of Ddrop/D0, the Sh follows a linear correlation with Re1/2Sc1/3.

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泊泽维尔流中蒸发液滴迁移的动力学

采用水平集与流体体积耦合(CLSVOF)方法，研究了初始直径液滴(Ddrop)在直径为D0的管内迁移时的蒸发过程，重点确定了变形液滴的传热传质系数。在有限差分框架下，采用嵌入边界法建立了处理汽化流动的鲁棒相变模型。该模型通过对基准问题的模拟得到了广泛的验证，例如静态液滴的任意蒸发和湿度测量数据的再现。结果表明，水滴在hageno - poiseuille流作用下经过一段初始瞬态后，其Sherwood数(Sh)和Nusselt数(Nu)达到一个稳定值。对液滴变形对蒸发速率的影响进行了参数化研究。观察到蒸发引起的斯特凡流动对液滴变形动力学的影响可以忽略不计。我们还观察到，对于不同的Ddrop/D0值，Sh与Re1/2Sc1/3呈线性相关。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Heat Transfer-transactions of The Asme 工程技术-工程：机械

自引率

0.00%

发文量

182

审稿时长

4.7 months

期刊介绍： Topical areas including, but not limited to: Biological heat and mass transfer; Combustion and reactive flows; Conduction; Electronic and photonic cooling; Evaporation, boiling, and condensation; Experimental techniques; Forced convection; Heat exchanger fundamentals; Heat transfer enhancement; Combined heat and mass transfer; Heat transfer in manufacturing; Jets, wakes, and impingement cooling; Melting and solidification; Microscale and nanoscale heat and mass transfer; Natural and mixed convection; Porous media; Radiative heat transfer; Thermal systems; Two-phase flow and heat transfer. Such topical areas may be seen in: Aerospace; The environment; Gas turbines; Biotechnology; Electronic and photonic processes and equipment; Energy systems, Fire and combustion, heat pipes, manufacturing and materials processing, low temperature and arctic region heat transfer; Refrigeration and air conditioning; Homeland security systems; Multi-phase processes; Microscale and nanoscale devices and processes.