Sub-THz components for high capacity point to multipoint wireless networks

C. Paoloni, S. Boppel, V. Krozer, R. Letizia, E. Limiti, F. Magne, Marc Marilier, A. Ramírez, B. Vidal, Trung Le, R. Zimmerman
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引用次数: 1

Abstract

The first point to multipoint wireless system at D-band (141 - 148.5 GHz), providing high capacity area sectors fed by high data rate G-band (275 - 305 GHz) links connected to fiber access points, will be described. It is the objective of the European Commission H2020 ULTRAWAVE “Ultra capacity wireless layer beyond 100 GHz based on millimeter wave Traveling Wave Tubes”. The high transmission power provided by novel millimeter wave traveling wave tube will allow an unprecedented range and data rate at this frequency band. A novel MMIC chipset including components built by GaAs and InP processes to realize a full electronics solution for the sub-THz wireless communication system will be described.
用于高容量点对多点无线网络的次太赫兹组件
将描述第一个d波段(141 - 148.5 GHz)的点对多点无线系统,该系统提供高容量区域扇区,由连接到光纤接入点的高数据速率g波段(275 - 305 GHz)链路馈送。这是欧盟委员会H2020 ULTRAWAVE“基于毫米波行波管的超过100 GHz的超容量无线层”的目标。新型毫米波行波管提供的高传输功率将允许在该频段实现前所未有的范围和数据速率。将介绍一种新型MMIC芯片组,包括由GaAs和InP工艺构建的组件,以实现亚太赫兹无线通信系统的完整电子解决方案。
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