Improvement of Photoelectrochemical and Stability Properties of Electrodeposited Cu2O Thin Films by Annealing Processes

S. Jamali, A. Moshaii, Nasim Mohammadian
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引用次数: 8

Abstract

The synthesization of Cu2O thin films by electrodeposition for photoelectrochemical water splitting is reported. The synthesized Cu2O samples are annealed at different temperatures between 300 and 500 °C. The XRD analysis and SEM images indicate that the sample without annealing includes Cu2O grains with pyramid shape. With annealing to more than 300 °C, due to the oxidization of the sample, a thin layer of CuO appears on the original Cu2O film and the crystalline signatures of such CuO structure increase with annealing at higher temperatures. The photoelectrochemical measurements indicate that annealing pure Cu2O by more than 300 °C, remarkably increases the photocurrent achieved from this photocathode. The effect is accompanied with considerable improvement of chemical stability of the original Cu2O electrode during water splitting. Such protection effect, which is originated from generation of CuO on the samples, increases with the annealing temperature up to 500 °C. However, the best photocurrent from the Cu2O/CuO composite is obtained from the annealing temperature of about 400 °C. The results of impedance analysis of various annealed samples indicate that annealing at a higher temperature, better charge transfer occurs both at the interface of photocathode/electrolyte and inside the photocathode.
退火工艺改善电沉积Cu2O薄膜的光电化学及稳定性
报道了电沉积法制备用于光电化学水分解的Cu2O薄膜。将合成的Cu2O样品在300 ~ 500℃的不同温度下退火。XRD分析和SEM图像表明,未经退火的试样中含有棱锥状Cu2O晶粒。当退火温度超过300℃时,由于样品的氧化作用,在原Cu2O膜上出现了一层薄薄的CuO,并且随着退火温度的升高,这种CuO结构的晶体特征增加。光电化学测量表明,将纯Cu2O退火300°C以上,可以显著提高该光电阴极的光电流。该效应伴随着原Cu2O电极在水分解过程中化学稳定性的显著改善。这种保护作用源于样品上CuO的生成,退火温度达到500℃时,保护作用增强。而Cu2O/CuO复合材料的最佳光电流是在400℃左右的退火温度下获得的。对不同退火样品的阻抗分析结果表明,退火温度越高,光电阴极/电解液界面和光电阴极内部的电荷转移越好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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