SiCp/Cu composites prepared by the dual-directional extrusion process of floating die

Abstract

SiCp/Cu composites were fabricated by the dual-directional extrusion process of the floating die. The microstructure, wear behavior and conductivity of SiCp/Cu composites were studied by optical microscope, abrasion test and current conductivity instrument. The results show that the SiCp/Cu composites with SiC particle distributed uniformly can be obtained, and the conductivity of composites decreased with the increasing of concentration of SiC particles, the wear resistance behavior of SiCp/Cu composites is evidently better than Cu with the increasing of concentration of SiC particles, the wearing mechanism of composites is a synthetically combined function of micro-cutting wearing and surface peeling off and grain wearing.