A High-Power-Density Four-switch Buck-boost Converter using 3D Multi-PCB Structure

2021 IEEE Applied Power Electronics Conference and Exposition (APEC) Pub Date : 2021-06-14 DOI:10.1109/APEC42165.2021.9487436

Qi Liu, Dejun Zheng, Min Zheng, Qinsong Qian, Shen Xu, Weifeng Sun

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引用次数: 2

Abstract

A high-power-density four-switch buck-boost (FSBB) converter based on 3D multi-PCB structure is proposed in this paper. Compared with the conventional planar solution, the two half-bridges of the FSBB converter are divided into two PCBs, which are arranged symmetrically on the left and right sides of the planar inductor. The control board is arranged on the bottom side of the planar inductor. PCBs of the power and control stage are wrapped around the planar inductor to form a 3D structure, which is similar to the expanded view of a cuboid. The 3D structure can effectively reduce the area wasted by the planar layout and thus improve power density. Moreover, the power loop in the 3D structure is optimized to reduce parasitic inductance as well as high-frequency voltage overshoot. Finally, a 280W FSBB prototype is built to verify the proposed structure, which achieves the peak efficiency of 98.1% at 1MHz switching frequency. Compared with the conventional planar structure, the power density increases from 90W/in3 to 432W/in3.

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基于3D多pcb结构的高功率密度四开关降压-升压转换器

提出了一种基于三维多pcb结构的高功率密度四开关降压升压(FSBB)转换器。与传统的平面解决方案相比，FSBB变换器的两个半桥被分成两个pcb，在平面电感器的左右两侧对称排列。控制板设置在平面电感器的底部。电源和控制级的pcb板包裹在平面电感器上形成三维结构，类似于长方体的展开视图。三维结构可以有效减少平面布局所浪费的面积，从而提高功率密度。此外，对三维结构中的功率环进行了优化，以减小寄生电感和高频电压过调。最后，建立了一个280W FSBB原型来验证所提出的结构，该结构在1MHz开关频率下达到了98.1%的峰值效率。与传统平面结构相比，功率密度从90W/in3提高到432W/in3。

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2021 IEEE Applied Power Electronics Conference and Exposition (APEC)

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