The Deep Etching Process Based on Parallel Laser Direct Writing System

Jin Hu, D. Pu, L. S. Chen
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Abstract

Due to the high cost-effectiveness, extra flexibility, and short production cycle, laser direct writing system as a kind of maskless lithography technology has been widely used in the fields of micro-nano-manufacturing. The working principle of the parallel laser direct writing system based on DMD(Digital Micromirror Device) is introduced. A novel negative photoresist -- dry film photoresist is adopted into the study of deep etching for the fabrication of the micro mold. The experimental results show that: the whole process is convenient, efficient and flexible; the precision of the 2-D patterning and the depth of etching is reliable.
基于并行激光直写系统的深刻蚀工艺
激光直写技术作为一种无掩模光刻技术,由于具有成本效益高、灵活性强、生产周期短等优点,在微纳制造领域得到了广泛的应用。介绍了基于数字微镜器件(DMD)的并行激光直写系统的工作原理。采用一种新型负型光刻胶——干膜光刻胶,研究了微模具的深蚀刻工艺。实验结果表明:整个过程方便、高效、灵活;二维图形的精度和刻蚀深度是可靠的。
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