Anisotropic and Multiscale Constitutive Framework for the Reliability of Microscale Interconnects Based on Damage Mechanics

Abstract

This paper presents the multiscale approach for investigating the new deformation and failure mechanisms including such deformation modes as single crystal slips and texture evolution as sub-grains and recrystallization. Failure criteria from microvoids and microcracks shall be embedded into constitutive equations for the power of failure process visualization. The constitutive framework developed by the first author for solder alloys has been furthermore advanced into the multiscale constitutive framework with damage evolution and failure criteria. The investigation is focus on the anisotropic and viscoplastic constitutive framework with texture evolution for tin-based lead-free solders. It is found that the ancient material is still challenging concurrent constitutive modeling and reliability of microscale lead-free solder joints.