Interconnect parasitic extraction in the digital IC design methodology

M. Kamon, S. McCormick, K. Sheperd
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引用次数: 15

Abstract

Accurate interconnect analysis has become essential not only for post-layout verification but also for synthesis. This tutorial explores interconnect analysis and extraction methodology on three levels: coarse extraction to guide synthesis, detailed extraction for full-chip analysis, and full 3D analysis for critical nets. We will also describe the electrical issues caused by parasitics and how they have, and will be, influenced by changing technology. The importance of model order reduction will be described as well as methodologies at the synthesis stage for avoiding parasitic problems.
数字集成电路设计方法中的互连寄生提取
准确的互连分析不仅对布局后验证,而且对综合也至关重要。本教程探讨互连分析和提取方法在三个层面:粗提取,以指导合成,详细提取全芯片分析,并为关键网全3D分析。我们还将描述由寄生虫引起的电气问题,以及它们如何受到不断变化的技术的影响。本文将描述模型降阶的重要性,以及在综合阶段避免寄生问题的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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