Metal film precision resistors: Resistive metal films and a new resistor concept

Abstract

Metal-films for precision resistors combine a very low temperature dependence of the electrical resistance with a tolerance of the resistance of only 0.1%. Corrosion resistance and adhesion to the substrate are of major importance. There are different classes of materials being utilised. For low ohmic applications, we use Cu-Ni alloys with a composition of about 65 at. % (atomic percent) of Cu. For this special alloy, the low temperature coefficient of the resistance (TCR) is a stable, intrinsic property. For most alloys, however, annealing is essential to approach the state of zero TCR. This is the case for the NiCrAl alloys, used for the mid-range of resistances and for SiCrN for high ohmic applications. In high ohmic films, metals are often combined with non-metallic substances like oxides or nitrides. Variation of alloy composition, sputtering conditions and annealing procedures are important for obtaining optimum thin-film properties. Important tools for thin-film characterisation are electron microscopy and related techniques together with high-temperature resistance measurement.