Analysis of the Mechanisms Underpinning Rainstorm-Induced Landslides

IF 0.8 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY

FDMP-Fluid Dynamics & Materials Processing Pub Date : 2023-01-01 DOI:10.32604/fdmp.2023.023637

S. Feng, Leipeng Liu, Chen Gao, Hang Hu

引用次数: 1

Abstract

The present study considers the damage mechanisms and the rainfall in ﬁ ltration process responsible for landslide phenomena which originate from accumulation slopes. Accordingly, a physical test model is developed for different slopes and different rainfall conditions. Moreover, a three-dimensional laser scanner and a camera are used to monitor the slope erosion and the landslide dynamic evolution. Using this approach, the time variation curves of volumetric water content, pore water pressure, soil pressure, slope deformation, and damage are determined. The results show that under similar conditions, similar trends of the pore water pressure are achieved for different slopes and rainfall intensities.

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暴雨诱发滑坡的机制分析

本文考虑了堆积体滑坡的破坏机制和渗流过程中的降雨对滑坡现象的影响。据此，建立了不同坡度和不同降雨条件下的物理试验模型。利用三维激光扫描仪和摄像机对坡面侵蚀和滑坡动力演变过程进行了监测。利用该方法确定了土体体积含水量、孔隙水压力、土压力、边坡变形和损伤的时间变化曲线。结果表明:在相似条件下，不同坡面和降雨强度下孔隙水压力变化趋势相似;

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

FDMP-Fluid Dynamics & Materials Processing MATERIALS SCIENCE, MULTIDISCIPLINARY-

CiteScore

1.60

自引率

61.50%

发文量

103

期刊介绍： The scope of the Journal is covered by these topics (which could be updated): interplay between fluid motion and materials preparation processes (by means of: experimental investigation; computer modeling & simulation; novel numerical techniques and multiprocessor computations); multi-phase and multi-component systems; pattern formation; multi-scale modeling; interface-tracking methods (e.g., VOF, level-set) and moving boundaries; fluid-structure interactions; solidification; semiconductor crystals; metallurgy; dynamics of dispersed particles, bubbles and droplets (sedimentation, Marangoni migration, coalescence mechanisms, interaction with advancing fronts, etc.); dynamics and static behavior of fluid surfaces and interfaces.