Evaluation of Intel Xeon E5-2600v2 based cluster for technical computing workloads

P. Gepner, V. Gamayunov, Wieslawa Litke, L. Sauge, C. Mazauric
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引用次数: 2

Abstract

In Intel's CPU releasing model, the new Ivy Bridge is a “TICK” that follows Sandy Bridge's (“TOCK”) microarchitecture principles, however, after undergoing a die shrink it is manufactured at 22nm. It also incorporates new micro-architectural upgrades. In this paper we shall evaluate the performance of a 16 bi-socket node cluster based on this 3rd generation Intel Xeon Processor E5-2697v2 meant for server and workstation market. The new architectural improvements are assessed via High Performance Computing Challenge (HPCC) benchmarks and NAS Parallel Benchmarks (NPB) where the interconnect technology is challenged by the standard Intel® MPI Benchmark suite performance evaluator. Finally we tested performance of the new system using the subset of the benchmark from PRACE consortium. We compare achieved results against the outcomes of the tests performed on clusters based on previous generations of Intel Xeon processors: Intel Xeon E5-2680 (“Sandy Bridge-EP”), Intel Xeon 5680 (“Westmere-EP”) and Intel Xeon 5570 (“Nehalem-EP”) respectively.
基于Intel至强E5-2600v2的集群技术计算工作负载评估
在英特尔发布的CPU模型中,新的Ivy Bridge是一个“TICK”,遵循Sandy Bridge(“TOCK”)的微架构原则,然而,在经历了芯片缩小之后,它是在22nm制造的。它还包含了新的微架构升级。在本文中,我们将评估基于第三代英特尔至强处理器E5-2697v2的16双插座节点集群的性能,该处理器适用于服务器和工作站市场。新的架构改进通过高性能计算挑战(HPCC)基准测试和NAS并行基准测试(NPB)进行评估,其中互连技术受到标准英特尔®MPI基准套件性能评估器的挑战。最后,我们使用来自PRACE联盟的基准子集测试了新系统的性能。我们将取得的结果与基于前几代英特尔至强处理器的集群上执行的测试结果进行了比较:分别是英特尔至强E5-2680(“Sandy Bridge-EP”)、英特尔至强5680(“Westmere-EP”)和英特尔至强5570(“Nehalem-EP”)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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