Reliability of Ultrathin Organic Insulating Films for 3D Package

Abstract

The preparation of polymer films on silicon (Si) is one of the key technologies for microelectronics, especially in 3D package. In this work, water-phase grafting is a novel technology for grafting polymer film in the solution using water as solvent. Poly(methacrylimide) (PMI) and poly(methylacrylic acid) (PMAA) initiated by 4-Nitrobenzene diazonium (NBD) tetrafluoroborate were radical grafted on 4-inch silicon wafer. With the help of SEM, ellipsometry, XPS and AFM, the surface morphology, properties of PMI and PMAA organic grafted films was firstly researched. After heat treatment (HT) of 50 °C or 200 °C, PMI and PMAA films had low dielectric constant, low dielectric dissipation factor and strong corrosion resistance. This is of great significance for the large-scale application of Water-phase grafted organic films.