Thermal cycling and stress relaxation response of Si-Al and Si-Al-SiO2 layered thin films

Y.-L. Shen, S. Suresh
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引用次数: 56

Abstract

The deformation of Si-Al and Si-Al-SiO2 multi-layered thin films in response to controlled sequences of constant- and variable-amplitude thermal cycling and isothermal exposures has been studied experimentally by recourse toin situ measurements of curvature changes which made use of the laser scanning technique. In an attempt to systematically isolate salient mechanistic features, a select set of companion experiments have also been conducted on the Si-SiO2 bi-layer system. In some cases, the layered solids have been subjected to as many as 14 thermal cycles between 20 and 450°C to examine the stability of thermally induced deformation. It is found that the variation of curvature with temperature reaches saturation after the first thermal cycle for the Si-Al bi-layer system. The presence of the SiO2 passivation layer, however, drastically alters the plastic deformation characteristics of the Al layer with the result that: (i) sharp transitions arise in the variation of curvature with temperature during constant-amplitude thermal cycling; (ii) as many as 12 thermal cycles are needed to attain saturation in the curvature-temperature hysteresis loops; (iii) the extent of stress relaxation is significantly reduced during isothermal hold periods in the heating or the cooling phase of the thermal cycle; and (iv) the effects of certain types of variable-amplitude thermal cycling on elastoplastic deformation are essentially suppressed. An elastoplastic analysis, presented by Sureshet al. (J. Mech. Phys. Solids42, 979, 1994) for multi-layer systems, has been used to interpret some of the experimental results obtained in this paper. The predictions of this analysis for curvature changes during thermal cycling (without isothermal hold periods) are found to capture many trends experimentally observed in the Si-Al and Si-Al-SiO2 layered systems. It is seen, however, that continuum analyses based upon assumptions of steady-state, power-law creep response for thethin Al film fail to capture the measured effects of the passivation layer on creep relaxation even at saturation.

Si-Al和Si-Al- sio2层状薄膜的热循环和应力松弛响应
利用激光扫描技术对Si-Al和Si-Al- sio2多层薄膜的曲率变化进行了原位测量,研究了硅铝和硅铝- sio2多层薄膜在恒定和可变振幅热循环和等温暴露的控制序列下的变形。为了系统地分离出显著的机理特征,我们还对Si-SiO2双层体系进行了一系列的配套实验。在某些情况下,层状固体在20至450°C之间进行了多达14次的热循环,以检查热诱导变形的稳定性。发现硅铝双层体系在第一次热循环后曲率随温度的变化达到饱和。然而,SiO2钝化层的存在极大地改变了Al层的塑性变形特性,其结果是:(1)在恒幅热循环过程中,曲率随温度的变化出现了急剧转变;(ii)在曲率-温度迟滞回路中达到饱和需要多达12个热循环;(iii)在热循环的加热或冷却阶段的等温保持期间,应力松弛的程度显着减小;(iv)某些类型的变幅热循环对弹塑性变形的影响基本上被抑制。一种弹塑性分析,由Sureshet等人提出。理论物理。Solids42, 979, 1994)用于多层系统,已用于解释本文中获得的一些实验结果。在热循环过程中(不含等温保持期)曲率变化的分析预测,发现捕获了在Si-Al和Si-Al- sio2层状体系中实验观察到的许多趋势。然而,可以看出,基于稳态、幂律蠕变响应假设的连续体分析,即使在饱和状态下,也无法捕捉到钝化层对蠕变松弛的测量影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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