Influence of a thick nitride layer on transmission loss in GaN-on-3C-SiC/low resistivity Si

A. Bose, Debaleen Biswas, S. Hishiki, Sumito Ouchi, K. Kitahara, K. Kawamura, A. Wakejima
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引用次数: 2

Abstract

Wereporttheeffectofathicknitridelayerontransmissionlossin GaN-on-3C-SiC/low resistivity Si (LR-Si). Microstrip lines of finite length and width with ground pads were fabricated on three GaN-on-3C-SiC/LR-Si epitaxial structures with varying nitride layer thicknesses of 3.2, 5.3, and 8.0 𝜇 m. The loss performance of microstrip lines on different substrates was evaluated in the frequency range of 0.1 to 9 GHz. The sample with 8.0 𝜇 m thick nitride layer showed a minimal loss of 0.3 dB/mm at 9 GHz compared to the other samples. The evaluated data from electromagnetic (EM) simulation also confirmed a decreasing trend of loss with increasing nitride layer thickness. Temperature dependent loss evaluation also verified the above fact.
厚氮化层对GaN-on-3C-SiC/低电阻率Si传输损耗的影响
研究了氮化氮层厚度对GaN-on-3C-SiC/低电阻率Si (LR-Si)传输损耗的影响。在氮化层厚度分别为3.2、5.3和8.0 μ m的3种GaN-on-3C-SiC/LR-Si外延结构上制备了带接地垫的有限长、有限宽微带线,并在0.1 ~ 9 GHz频率范围内对微带线在不同衬底上的损耗性能进行了评价。氮化层厚度为8.0 μ m的样品在9 GHz时的损耗最小,为0.3 dB/mm。电磁模拟的评估数据也证实了损耗随氮化层厚度的增加而减小。温度相关损耗评估也验证了上述事实。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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