A Surface Potential and Drain Current Model for Tri-Gate FinFET: Analysis of Below 10nm Channel Length

Suparna Panchanan, R. Maity, N. Maity
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引用次数: 3

Abstract

A drain current model based on Lambert W function is analyzed for lightly doped (undoped) short channel tri gate FinFET (TG-FinFET). The channel length modulation (CLM), the effect of series resistance, mobility degradation and saturation velocity are included in the drain current model. Quantum mechanical effect (QME) is also included to achieve precise drain current for such a small channel device. The model is inspected mainly for two fin widths with two dielectric materials namely, silicon dioxide (SiO2) and hafnium oxide (HfO2). A complete study of electrical parameters including surface potential and the threshold voltage are addressed for both the dielectric materials. The threshold voltage is cross-examined by reported experimental results.
三栅极FinFET的表面电位和漏极电流模型:小于10nm通道长度的分析
分析了浅掺杂(未掺杂)短通道三栅极FinFET (TG-FinFET)基于Lambert W函数的漏极电流模型。漏极电流模型考虑了通道长度调制(CLM)、串联电阻、迁移率退化和饱和速度的影响。量子力学效应(QME)也包括在内,以实现精确的漏极电流为这样一个小通道器件。该模型主要对两种介质材料即二氧化硅(SiO2)和氧化铪(HfO2)的两种翅片宽度进行检测。对这两种介质材料的电学参数,包括表面电位和阈值电压进行了全面的研究。阈值电压与已报道的实验结果进行了交叉检验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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