Properties of Thick Printed Copper Films on Alumina Substrates

Abstract

This paper is focused on the properties of Thick Printed Copper (TPC)films with various thickness. TPC technology is based on well-known thick film technology and it is used for power substrate manufacturing as an alternative solution to standard DBC or AMB substrates. The thickness of TPC films has a significant influence on the electrical, mechanical and thermal properties of these films. The changes in these properties depending on the thickness of TPC films are described in this paper.