Fabrication and Characterization of Copper Phthalocyanine- Based Field Effect Transistors

N. Uranbileg, Tuul Tsagaantsooj, Anar Enkhbayar, Davaajargal Darambazar, Munkh-Erdene Erdene-Ochir, Ganzorig Chimed
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Abstract

Future generations of electronic products will be enabled by flexible electronic circuits, displays, and sensors based on organic active materials, which could eventually reach the mainstream electronics industry. One of such devices is the organic field-effect transistor (OFET), which are three-terminal devices that are comprised of a gate, source, and drain electrode. In this study, we fabricated a bottom-gate bottom-contact OFET device using copper phthalocyanine (CuPc) as a semiconducting layer. CuPc is a commercially available metal complex, a known p-type semiconducting material. Au/Ti electrode is sputtered on Al gated silicon substrate with thermally grown SiO2 dielectric layer. CuPc films were then deposited over the substrate with patterned electrodes by physical vapor deposition at a rate of 0.35 nm/s, recorded by a quartz crystal microbalance at room temperature under a background pressure of 1.21x10 Pa. A thin layer of organic material was also deposited on glass slides and the optical properties of films with different thicknesses were determined by UV-Vis spectrometry and the optical band-gap energy was determined to be 1.64±0.01 eV. The thermal annealing effect on thin-film crystallization morphology was studied with atomic force microscopy (AFM) and contact angle measurement.
酞菁铜基场效应晶体管的制备与表征
未来几代电子产品将由基于有机活性材料的柔性电子电路、显示器和传感器实现,最终将进入主流电子产业。其中一种器件是有机场效应晶体管(OFET),它是由栅极、源极和漏极组成的三端器件。在本研究中,我们以酞菁铜(CuPc)为半导体层,制作了一个底栅底接触OFET器件。CuPc是一种商业上可用的金属复合物,一种已知的p型半导体材料。Au/Ti电极溅射在Al门控硅衬底上,衬底上有热生长的SiO2介电层。在1.21x10 Pa的背景压力下,以0.35 nm/s的速率,通过石英晶体微天平在室温下记录CuPc薄膜的物理气相沉积。在玻片上沉积了一层薄薄的有机材料,用紫外-可见光谱法测定了不同厚度薄膜的光学性能,测得其带隙能为1.64±0.01 eV。利用原子力显微镜(AFM)和接触角测量研究了热退火对薄膜结晶形貌的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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