Interleaving Boost Extender Topology

Abstract

An efficient first stage interleaving technique for Boost Extender topology is presented. A unique single conversion operation of the boost extender topology, and current stress distribution between the modules pose a challenge on creating a successful and efficient interleaving scheme with this converter. A mechanism is developed, where a supporting first stage in a multilevel high voltage gain structure is added. The supporting stage shares the high current stress of the first boosting stage, compatible with interleaving technique, which reduces the ripples of each inductor along with the input and first stage output capacitor ripples. In addition, the voltage multiplication modules are shared between the interleaved stages providing significant component reduction comparing to traditional interleaving schemes. The concept was validated on a 260W experimental laboratory prototype. Theoretical predictions well agree with simulation and experimental results.