VHSIC phase 2 technology and the EHF modem/controller

Abstract

The author conducts a brief survey of TRW very-high-speed integrated circuits (VHSIC) Phase 2 technology and then explores its potential benefits along with its limitations to an EHF modem/controller. The impact of TRW VHSIC Phase 2 SuperChips is analyzed for the overall command-post and manpack modem/controller requirements, hardware architecture, data/control flow and mechanical design. It is found that the use of TRW VHSIC Phase 2 chips results in an order-of-magnitude improvement of size, weight, power, and reliability over conventional technology. Design areas which potentially limit the impact of high levels of integration are also discussed, along with their solutions.<>