Assessment of Reliability Enhancement in High-Power CPUs and GPUs Using Dynamic Direct-to-Chip Liquid Cooling

IF 1.5 4区工程技术 Q3 ENGINEERING, MECHANICAL

Journal of Enhanced Heat Transfer Pub Date : 2022-01-01 DOI:10.1615/jenhheattransf.2022043858

Pardeep Shahi, Amitha Mathew, S. Saini, Akash Akash, Pratik V. Bansode, Rajesh Kasukurthy, D. Agonafer

引用次数: 1

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采用动态直接对片液冷的大功率cpu和gpu可靠性增强评估

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来源期刊

Journal of Enhanced Heat Transfer 工程技术-工程：机械

CiteScore

3.60

自引率

8.70%

发文量

审稿时长

12 months

期刊介绍： The Journal of Enhanced Heat Transfer will consider a wide range of scholarly papers related to the subject of "enhanced heat and mass transfer" in natural and forced convection of liquids and gases, boiling, condensation, radiative heat transfer. Areas of interest include: ■Specially configured surface geometries, electric or magnetic fields, and fluid additives - all aimed at enhancing heat transfer rates. Papers may include theoretical modeling, experimental techniques, experimental data, and/or application of enhanced heat transfer technology. ■The general topic of "high performance" heat transfer concepts or systems is also encouraged.