A study of the states kinetics in NBTI degradation by two-stage NBTI model implementation

A. F. Muhammad Alimin, S. F. Wan Muhamad Hatta, N. Soin
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Abstract

This paper presents a simulation framework for reliability analysis of PMOS devices in the TCAD Sentaurus environment. The degradation of parameter is based on the numerical solution for the two-stage NBTI model mechanism. We demonstrate and analyze the voltage degradation, Vth of a high-k HfO2 dielectric pMOSFET structure with effective oxide thickness (EOT) of 1.092 nm. After 1000s of stress, the threshold voltage shift of higher stress bias shows higher degradation (~0.07V) compared to the lower stress bias (~0.008V).
基于两阶段NBTI模型的NBTI降解状态动力学研究
本文提出了一种用于TCAD Sentaurus环境下PMOS器件可靠性分析的仿真框架。参数退化是基于两阶段NBTI模型机构的数值解。我们演示并分析了一个有效氧化厚度(EOT)为1.092 nm的高k HfO2介电pMOSFET结构的电压退化Vth。在1000s的应力作用下,高应力偏置的阈值电压位移比低应力偏置(~0.008V)表现出更高的退化(~0.07V)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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