{"title":"Optical wireless receiver circuit with integrated APD and high background-light immunity","authors":"P. Brandl, R. Enne, H. Zimmermann","doi":"10.1109/ESSCIRC.2015.7313825","DOIUrl":null,"url":null,"abstract":"This paper presents two different monolithically integrated optoelectronic receiver circuits in one chip. One circuit includes a 200 μm diameter, high responsivity avalanche photodiode with a highly-sensitive receiver for wireless optical data communication at a data rate of 1Gbps with a sensitivity of -31.8 dBm. The second circuit includes two PN-photodiodes and a differential TIA with a nonlinear feedback to detect light power differences down to -90 dBm. The second circuit is implemented twice: for beam positioning in x- and y-direction. The chip was fabricated in a 0.35 μm high-voltage CMOS technology and tested under strong background-light conditions representative for optical wireless communication scenarios.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":"28 1","pages":"48-51"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2015.7313825","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper presents two different monolithically integrated optoelectronic receiver circuits in one chip. One circuit includes a 200 μm diameter, high responsivity avalanche photodiode with a highly-sensitive receiver for wireless optical data communication at a data rate of 1Gbps with a sensitivity of -31.8 dBm. The second circuit includes two PN-photodiodes and a differential TIA with a nonlinear feedback to detect light power differences down to -90 dBm. The second circuit is implemented twice: for beam positioning in x- and y-direction. The chip was fabricated in a 0.35 μm high-voltage CMOS technology and tested under strong background-light conditions representative for optical wireless communication scenarios.