Adjacent Track Interference in Three-Dimensional Heat-Assisted Magnetic Recording

Q3 Engineering
T. Kobayashi, Y. Nakatani, Y. Fujiwara
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引用次数: 1

Abstract

We examine the adjacent track interference (ATI) problem that arises during three-dimensional heat-assisted magnetic recording (3D HAMR) at 2 Tbpsi per layer (total density of 4 Tbpsi) where the medium consists of a high Curie temperature (HC) layer and a low Curie temperature (LC) layer. To evaluate the grain error distribution, the expected magnetization value is calculated using the grain error probability. Prior to considering the ATI in 3D HAMR, we examine the ATI problem for conventional HAMR. Since the temperature of the LC layer in the adjacent tracks while writing in the HC layer (HC writing) exceeds the LC Curie temperature, HC writing will erase the data of the LC layer in the adjacent tracks. Therefore, we investigate 3D HAMR combined with shingled magnetic recording. The ATI in an LC (upper, namely, surface) / HC (lower) layer structure is compared with that in an HC / LC layer structure. The latter is disadvantageous in relation to ATI caused by the small thermal gradient in the LC layer.
三维热辅助磁记录中的相邻磁道干扰
我们研究了在每层2 Tbpsi(总密度为4 Tbpsi)的介质中由高居里温度层(HC)和低居里温度层(LC)组成的三维热辅助磁记录(3D HAMR)过程中出现的相邻磁道干扰(ATI)问题。为了评估颗粒误差分布,利用颗粒误差概率计算期望磁化值。在考虑三维HAMR中的ATI之前,我们研究了传统HAMR中的ATI问题。由于HC层写入时相邻道的LC层温度(HC写入)超过了LC居里温度,因此HC写入会擦除相邻道的LC层数据。因此,我们研究了三维HAMR结合瓦式磁记录的方法。将LC(上层即表面)/ HC(下层)层结构中的ATI与HC / LC层结构中的ATI进行比较。由于LC层的热梯度小,后者相对于ATI是不利的。
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来源期刊
Journal of the Magnetics Society of Japan
Journal of the Magnetics Society of Japan Engineering-Electrical and Electronic Engineering
CiteScore
2.00
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