Holisitic device exploration for 7nm node

P. Raghavan, M. Bardon, D. Jang, P. Schuddinck, D. Yakimets, J. Ryckaert, A. Mercha, N. Horiguchi, N. Collaert, A. Mocuta, D. Mocuta, Z. Tokei, D. Verkest, A. Thean, A. Steegen
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引用次数: 30

Abstract

In this paper, we review the conditions at which FinFETs could meet system requirements at the 7nm node. We explore the key enablers to meet the power performance targets for 7nm node. We show that the device parasitics is the biggest performance detractor as we scale down. We illustrate the device design space that allows to meet speed and power targets, then explore the optimization of the geometry in combination with disruptive solutions such as air gap spacers and wrapped contacts, the benefits and drawbacks of increased fin height, and the design level solutions such as fin depopulation.
7nm节点整体器件探索
在本文中,我们回顾了在7nm节点上finfet可以满足系统要求的条件。我们探索了满足7nm节点功耗性能目标的关键使能因素。我们发现,当我们缩小规模时,设备寄生是最大的性能减损因素。我们阐述了能够满足速度和功率目标的器件设计空间,然后探讨了结合破坏性解决方案(如气隙间隔器和包裹触点)的几何结构优化,增加鳍高度的优点和缺点,以及设计层面的解决方案(如鳍减少)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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