Scratching a soft layer above a hard substrate

IF 1.5 4区 材料科学 Q4 MATERIALS SCIENCE, MULTIDISCIPLINARY
Iyad Alabd Alhafez, M. Kopnarski, H. Urbassek
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引用次数: 0

Abstract

ABSTRACT Soft layers may develop on a harder substrate during tribological processes. We perform molecular dynamics simulations of a model system, in which a hard substrate covered by a 4-nm thick soft layer is indented and scratched with a spherical tip along the surface. When scratching at a depth of only d = 2 nm – i.e. fully in the soft layer – the friction coefficient μ is the same as in a homogeneous (purely soft or hard) material; this is expected since in the ploughing regime, the friction coefficient of a sphere depends only on the indentation depth but not on the material. When scratching at d = 4 nm – i.e. at the interface between soft and hard material – μ of the bilayer material is strongly reduced compared to both the soft and the hard material. This reduction is caused by the fact that the scratching force is similar to that in a purely soft material, while the normal force is increased towards its value in the hard material. This effect also persists when scratching at d = 6 nm.
在坚硬的基材上刮擦软层
在摩擦学过程中,软层可能在较硬的衬底上形成。我们对一个模型系统进行了分子动力学模拟,在这个模型系统中,坚硬的衬底上覆盖了一层4纳米厚的软层,在表面上形成了凹痕和划痕。当深度仅为d = 2 nm时-即完全在软层中-摩擦系数μ与均匀(纯软或纯硬)材料相同;这是可以预料的,因为在犁耕状态下,球体的摩擦系数只取决于压痕深度,而不取决于材料。当在d = 4 nm处(即软硬材料的界面处)刮擦时,与软硬材料相比,双层材料的μ值都大大降低。这种减少是由于划痕力与纯软材料中的划痕力相似,而法向力在硬材料中的值增加。当在d = 6 nm处划痕时,这种效应仍然存在。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Philosophical Magazine
Philosophical Magazine 工程技术-材料科学:综合
自引率
0.00%
发文量
93
审稿时长
4.7 months
期刊介绍: The Editors of Philosophical Magazine consider for publication contributions describing original experimental and theoretical results, computational simulations and concepts relating to the structure and properties of condensed matter. The submission of papers on novel measurements, phases, phenomena, and new types of material is encouraged.
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