Coupled numerical analysis of Suspended gate field effect transistor (SGFET)

K. Jayaprakash Reddy., C. K. Malhi, R. Pratap, N. Bhat
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引用次数: 6

Abstract

Suspended gate MOSFETs exist since last few decades. Resonant gate transistors were first demonstrated as a means of getting high Q devices [1]. The advantages of transistor based transduction as compared to the capacitive detection have also been demonstrated [2,3]. The behaviors of SGFETs have been studied using equivalent lumped parameter modeling methodology [4–7]. Numerical simulations involving “hybrid” FEA coupling between two different tools, ANSYS Multiphysics and ISE-DESIS, with the help of an external Perl script have also been tried [8]. Here ANSYS is used for the coupled electrostatic and structural physics calculations and ISE-DESIS provides the correct boundary conditions for the electrostatic domain using semiconductor physics. Another related study [9] solved the beam equation coupled with the Poisson equation numerically using finite difference and Newton Raphson method. Our work presents an easier modeling and analysis of a suspended gate MOSFET in COMSOL, successfully demonstrating a solution of a moving gate type device. In our analysis, we consider the air gap as a deformable continuum and we report the standard Id-Vg characteristics of the transistor. Commercially available packages such as ISE-DESIS specialize in only fixed gap analysis wherein air is also modeled as a material with a known permittivity. In such an analysis the capacitor formed due to the air gap remains fixed. We demonstrate here that this analysis can be easily carried out in COMSOL using its multiphysics features. Using two dimensional analysis involving structural mechanics domain, moving mesh ALE, convection and diffusion, and the electrostatics domain, the effect of moving gate and hence the moving air gap can be modeled and analyzed.
悬浮栅场效应晶体管(SGFET)的耦合数值分析
悬栅mosfet已经存在了几十年。谐振栅极晶体管首先被证明是获得高Q器件的一种手段[1]。与电容检测相比,基于晶体管的转导的优势也得到了证明[2,3]。已经使用等效集总参数建模方法研究了sgfet的行为[4-7]。在外部Perl脚本的帮助下,还尝试了涉及两种不同工具ANSYS Multiphysics和ISE-DESIS之间“混合”有限元耦合的数值模拟[8]。本文采用ANSYS进行静电和结构物理耦合计算,ISE-DESIS利用半导体物理为静电域提供了正确的边界条件。另一相关研究[9]采用有限差分法和Newton Raphson法对梁方程与泊松方程耦合进行数值求解。我们的工作在COMSOL中提供了一个更容易的悬栅MOSFET建模和分析,成功地展示了一个移动栅极型器件的解决方案。在我们的分析中,我们认为气隙是一个可变形的连续体,我们报告了晶体管的标准Id-Vg特性。ISE-DESIS等商用封装只专注于固定间隙分析,其中空气也被建模为具有已知介电常数的材料。在这种分析中,由于气隙形成的电容器保持固定。我们在这里证明,这种分析可以很容易地在COMSOL中使用其多物理场特性进行。利用结构力学领域、动网格ALE、对流扩散和静电领域的二维分析,可以对动栅极的影响以及由此产生的动气隙进行建模和分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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