A Silicon Image Guide (SIG) technology platform for high performance sub-millimeter-wave passive structures

Abstract

A low-loss and low-cost Silicon Image Guide (SIG) platform for realization of high performance sub-millimeter-wave and THz integrated systems is proposed. The implementation of an extremely low-loss bend and 3-dB power divider, as typical examples of high performance passive components realizable by the proposed technology, are presented. The SIG structures are fabricated using a fast and mask-free laser machining technique. The measured average insertion loss of the SIG is remarkably small, less than 0.035 dB/mm over the frequency range of 110- 170 GHz. A very low-loss bend with a bending loss less than 0.25 dB/90° at 150 GHz for the curvatures with the radius as small as 2 mm is also demonstrated.