MINIATURIZED PHOTONIC AND MICROWAVE INTEGRATED CIRCUITS BASED ON SURFACE PLASMON POLARITONS

Dayue Yao, P. He, Hao Chi Zhang, Jiawen Zhu, Mingze Hu, T. Cui
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引用次数: 1

Abstract

|Photonic integrated circuits (PICs) and microwave integrated circuits (MICs) have been widely studied, but both of them face the challenge of miniaturization. On one hand, the construction of photonic elements requires spaces proportional to wavelength, and on the other hand, electromagnetic compatibility issues make it challenging to reach high-density layouts for MICs. In this paper, we review the research advances of miniaturized PICs and MICs based on surface plasmon polaritons (SPPs). By introducing SPPs, miniaturized photonic elements at subwavelength scales are realized on PICs, which can be used for highly integrated interconnects, biosensors, and visible light wireless communications. For MICs, since the metals behave as perfect conductors rather than plasmonic materials at microwave frequencies, plasmonic metamaterials are proposed to support spoof SPPs. Spoof SPPs possess similar characteristics to SPPs and can be used to realize high-density channels on MICs. Moreover, combining the latest theoretical research on SPPs, future tendencies of SPP-based MICs are discussed as well, including further miniaturization, digitization, and systematization.
基于表面等离子激元极化子的小型化光子和微波集成电路
光子集成电路(PICs)和微波集成电路(mic)得到了广泛的研究,但它们都面临着小型化的挑战。一方面,光子元件的构造需要与波长成正比的空间,另一方面,电磁兼容性问题使得mic达到高密度布局具有挑战性。本文综述了基于表面等离子激元(SPPs)的微型化PICs和mic的研究进展。通过引入spp,在PICs上实现了亚波长尺度的小型化光子元件,可用于高度集成的互连、生物传感器和可见光无线通信。对于mic,由于金属在微波频率下表现为完美导体,而不是等离子体材料,因此提出了等离子体超材料来支持欺骗spp。欺骗spp具有与spp相似的特性,可用于实现mic上的高密度通道。并结合spp的最新理论研究,探讨了基于spp的MICs的未来发展趋势,包括进一步小型化、数字化和系统化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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