Reliability evaluation of buck converter based on thermal analysis

IF 0.6 4区工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC

Informacije Midem-Journal of Microelectronics Electronic Components and Materials Pub Date : 2019-02-01 DOI:10.33180/infmidem2018.404

M. Mojibi, M. Radmehr

引用次数: 1

Abstract

The design, which is based on the concept of reliability, is impressive. In power electronic circuits, the reliability design has been shown to be useful over time. Moreover, power loss in switches and diodes plays a permanent role in reliability assessment. This paper presents a reliability evaluation for a buck converter based on thermal analysis of an insulated-gate bipolar transistor (IGBT) and a diode. The provided thermal analysis is used to determine the switch and diode junction temperature. In this study, the effects of switching frequency and duty cycle are considered as criteria for reliability. A limit of 150°C has been set for over-temperature issues. The simulation of a 12 kW buck converter (duty cycle = 42% and switching frequency = 10 kHz) illustrates that the switch and diode junction temperature are 117.29°C and 122.27°C, respectively. The results show that mean time to failure for the buck converter is 32,973 hours.

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基于热分析的buck变换器可靠性评估

基于可靠性概念的设计令人印象深刻。在电力电子电路中，随着时间的推移，可靠性设计已被证明是有用的。此外，开关和二极管的功率损耗在可靠性评估中起着永久的作用。本文提出了一种基于绝缘栅双极晶体管(IGBT)和二极管热分析的降压变换器可靠性评估方法。所提供的热分析用于确定开关和二极管的结温。在本研究中，考虑了开关频率和占空比的影响作为可靠性的标准。150°C的限制已设置为过热问题。对一个12kw降压变换器(占空比为42%，开关频率为10khz)的仿真表明，开关温度和二极管结温度分别为117.29℃和122.27℃。结果表明，降压变换器的平均无故障时间为32973小时。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Informacije Midem-Journal of Microelectronics Electronic Components and Materials 工程技术-材料科学：综合

CiteScore

1.80

自引率

0.00%

发文量

审稿时长

>12 weeks

期刊介绍： Informacije MIDEM publishes original research papers in the fields of microelectronics, electronic components and materials. Review papers are published upon invitation only. Scientific novelty and potential interest for a wider spectrum of readers is desired. Authors are encouraged to provide as much detail as possible for others to be able to replicate their results. Therefore, there is no page limit, provided that the text is concise and comprehensive, and any data that does not fit within a classical manuscript can be added as supplementary material. Topics of interest include: Microelectronics, Semiconductor devices, Nanotechnology, Electronic circuits and devices, Electronic sensors and actuators, Microelectromechanical systems (MEMS), Medical electronics, Bioelectronics, Power electronics, Embedded system electronics, System control electronics, Signal processing, Microwave and millimetre-wave techniques, Wireless and optical communications, Antenna technology, Optoelectronics, Photovoltaics, Ceramic materials for electronic devices, Thick and thin film materials for electronic devices.