The analysis of measurement methods for high power LED thermal resistance

Hongmin Wang, Jing-Yu Dong, Zhili Liu, Bingru Liang
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引用次数: 4

Abstract

With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. Based on the study of high power LED thermal resistance and its basic measurement principle, this paper provides an analysis of the different measurement methods for thermal resistance, including of infrared thermal imaging method, spectra method, electrical parameters method, and so on, then compares and analyses their merits and shortcomings, applicable areas and improvement measures that provide the reliable basis for measuring the thermal resistance of high power LED.
大功率LED热阻测量方法分析
随着大功率LED技术的发展,结温作为制约LED性能和使用寿命的关键因素,而结温的主要参数是热阻。因此,如何快速准确地测量大功率LED的热阻,对提高LED的性能和使用寿命有着重要的作用。本文在研究大功率LED热阻及其基本测量原理的基础上,分析了热阻的不同测量方法,包括红外热成像法、光谱法、电参数法等,比较分析了它们的优缺点、适用范围和改进措施,为大功率LED热阻的测量提供了可靠的依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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