Operational and manufacturing environment CE validation tools

A. Sellars
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引用次数: 0

Abstract

The vast majority of failures in electronic systems are due to thermal and vibration stresses. Major improvements in product reliability can be attained by validating the printed circuit board assembly (PCBA) design with respect to the thermal and vibration/shock environments in operation, manufacturing, and test. This PCBA design validation is accomplished with application-specific finite element analysis tools developed by Pacific Numerix Corporation, linked with common CAE/CAD tools in a PCBA level concurrent engineering (CE) system. Also included in this CE system is the capability to validate the PCBA design with respect to electromagnetic parasitics. Designs can be validated before the printed circuit board (PCB) is fabricated and assembled, resulting in a more reliable product, reduced quality costs and reduced product development cycle time. Communication inadequacies between various engineering disciplines and between engineering, manufacturing, and test is one of the major obstacles to concurrent engineering that is improved with this PCBA CE system.<>
操作和制造环境CE验证工具
电子系统中的绝大多数故障是由于热应力和振动应力引起的。通过验证印刷电路板组件(PCBA)设计在操作、制造和测试中的热和振动/冲击环境,可以实现产品可靠性的重大改进。PCBA设计验证是通过Pacific Numerix公司开发的特定应用的有限元分析工具完成的,该工具与PCBA级并行工程(CE)系统中的常见CAE/CAD工具相关联。该CE系统还包括验证PCBA设计的电磁寄生能力。设计可以在印刷电路板(PCB)制造和组装之前进行验证,从而产生更可靠的产品,降低质量成本并缩短产品开发周期。不同工程学科之间以及工程、制造和测试之间的沟通不足是并行工程的主要障碍之一,该PCBA CE系统改进了并行工程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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