{"title":"A cascadable 200 GOPS motion estimation chip for HDTV applications","authors":"J. Berns, T. Noll","doi":"10.1109/CICC.1996.510574","DOIUrl":null,"url":null,"abstract":"A flexible block matching motion estimation chip is described with variable sized blocks between 8/spl times/8 and 32/spl times/32 pixels. Each chip performs block matching with a search area of /spl plusmn/15 vertically and horizontally for a block size of 32/spl times/32. For larger search areas devices can be cascaded. Besides full search, fast algorithms can be emulated. Sub-pel precision motion vectors can be calculated using a smaller search area or cascading devices. The chip will have a computational power of more than 200 GOPS and a die size of 170 mm/sup 2/ in an 0.5-/spl mu/m CMOS technology.","PeriodicalId":74515,"journal":{"name":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","volume":"8 1","pages":"355-358"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the ... Custom Integrated Circuits Conference. Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1996.510574","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
A flexible block matching motion estimation chip is described with variable sized blocks between 8/spl times/8 and 32/spl times/32 pixels. Each chip performs block matching with a search area of /spl plusmn/15 vertically and horizontally for a block size of 32/spl times/32. For larger search areas devices can be cascaded. Besides full search, fast algorithms can be emulated. Sub-pel precision motion vectors can be calculated using a smaller search area or cascading devices. The chip will have a computational power of more than 200 GOPS and a die size of 170 mm/sup 2/ in an 0.5-/spl mu/m CMOS technology.