Packaging of micro strain sensors

Abstract

This paper presents results of studies on the packaging of micro strain sensors attached to a stainless steel base as a module and techniques of rapid attachment of sensor modules to substrates to be measured. Strain coupling from the substrate to the sensors using different packaging designs and processes can either enhance or attenuate strains experienced by the sensors. Analytical models were developed to predict the enhancement and transmission loss from the packaging materials and processes used. Experiments were carried out with results verifying that the analysis is accurate to a few percentages of assumed properties. Rapid bonding techniques were developed, which combine spot welding and adhesive bonding with selected bonding materials, to bond pre-packaged sensor modules to substrates in 30 seconds instead of hours as in conventional methods.