L. John, M. Ohlrogge, S. Wagner, C. Friesicke, A. Tessmann, A. Leuther, T. Zwick
{"title":"In situ Load- Pull MMIC for Large-Signal Characterization of mHEMT Devices at Submillimeter- Wave Frequencies","authors":"L. John, M. Ohlrogge, S. Wagner, C. Friesicke, A. Tessmann, A. Leuther, T. Zwick","doi":"10.1109/MWSYM.2018.8439391","DOIUrl":null,"url":null,"abstract":"An in situ load-pull MMIC with preamplifier and tunable output matching network in a 35 nm InAlAs/InGaAs technology is presented in this paper. The load impedance tuning is realized using an open-circuit stub network with shunt-FETs. The tunable load impedance range and the large-signal characterization of a 2×15 μm device is demonstrated at 300 GHz. With this MMIC the unique characterization and large-signal model validation of mHEMT devices at sub-mm wave frequencies is possible. The total chip area required for large-signal characterization of a single device is 1850 μm × 400 μm.","PeriodicalId":6675,"journal":{"name":"2018 IEEE/MTT-S International Microwave Symposium - IMS","volume":"18 1","pages":"761-764"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE/MTT-S International Microwave Symposium - IMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2018.8439391","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
An in situ load-pull MMIC with preamplifier and tunable output matching network in a 35 nm InAlAs/InGaAs technology is presented in this paper. The load impedance tuning is realized using an open-circuit stub network with shunt-FETs. The tunable load impedance range and the large-signal characterization of a 2×15 μm device is demonstrated at 300 GHz. With this MMIC the unique characterization and large-signal model validation of mHEMT devices at sub-mm wave frequencies is possible. The total chip area required for large-signal characterization of a single device is 1850 μm × 400 μm.