Electron Beam‐Irradiated Au/h‐BN/Au Cross‐Point Memristors

Mucun Li, E. Wu, Linyan Xu, X. Hu, Xiaopu Miao, Jing Liu
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Abstract

Applying 2D materials to build memristors is a promising strategy that has attracted great interest in the semiconductor field in recent years. Although the study of memristors based on chemical vapor deposition (CVD) with lattice defects has been well established, the applications and detailed knowledge of the ones using mechanical exfoliation with good lattice structures are still scarce. Herein, the resistive switching behavior of an array of 3 μm × 3 μm cross‐point Au/25.7 nm mechanically exfoliated h‐BN/Au memristors is investigated after a controllable electron beam doping process. An electron beam irradiation strategy is first proposed to treat h‐BN memristors with intact lattice structure. Devices with moderate electron beam irradiation, which is about 1500 or 2000 mC cm−2, show good resistive switching curves. The memristor device has a repeatable resistive switching behavior, an on/off ratio of 108, a set voltage as low as 5 V, and a retention higher than 1000 s. This strategy provides an alternative method to improve the performance of memristor. Mechanical exfoliated h‐BN preserves the lattice structure, which is an immediate advantage to fabricate memristor using it compared to that fabricated by CVD.
电子束辐照Au/h - BN/Au交叉点记忆电阻器
应用二维材料构建忆阻器是近年来半导体领域的一个很有前途的策略。虽然基于化学气相沉积(CVD)的具有晶格缺陷的忆阻器的研究已经很好地建立了,但使用具有良好晶格结构的机械剥离的忆阻器的应用和详细知识仍然很少。本文采用可控电子束掺杂工艺,研究了3 μm × 3 μm交叉点Au/25.7 nm机械剥离h - BN/Au记忆电阻器阵列的电阻开关行为。首次提出了电子束辐照处理完整晶格结构的氢氮化硼记忆电阻器的方法。在中等电子束辐照下(约1500或2000 mC cm−2),器件表现出良好的电阻开关曲线。该忆阻器器件具有可重复的电阻开关行为,通/关比为108,设定电压低至5 V,保持时间高于1000 s。该策略为提高忆阻器的性能提供了另一种方法。机械剥离的氢氮化硼保留了晶格结构,与CVD制造的忆阻器相比,使用它制造忆阻器具有直接的优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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