{"title":"A new testing technique for researching procedure in curing of high polymers","authors":"Chen Daqian, Fan Jiang, H. Zhimin, Ge Zhengyan","doi":"10.1109/ICPADM.1991.172228","DOIUrl":null,"url":null,"abstract":"The authors describe multifunction test equipment for measuring and recording the dielectric spectrum, thermogram, and start-end gel-time of a high polymer specimen from liquid state to cure state. It is shown that the change of the polymer from liquid to solid during a complex cure process can be sensitively and accurately monitored by the dielectric analysis technique. A correlation of three parameters (viscosity, differential thermal analysis, and dielectric dissipation analysis) is established in order to supervise the technological measurement.<<ETX>>","PeriodicalId":6450,"journal":{"name":"[1991] Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials","volume":"23 1","pages":"946-948 vol.2"},"PeriodicalIF":0.0000,"publicationDate":"1991-07-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1991] Proceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICPADM.1991.172228","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The authors describe multifunction test equipment for measuring and recording the dielectric spectrum, thermogram, and start-end gel-time of a high polymer specimen from liquid state to cure state. It is shown that the change of the polymer from liquid to solid during a complex cure process can be sensitively and accurately monitored by the dielectric analysis technique. A correlation of three parameters (viscosity, differential thermal analysis, and dielectric dissipation analysis) is established in order to supervise the technological measurement.<>