Deep level investigation of INGAAS on INP layer

Chong Wang, E. Simoen, A. Alireza, S. Sioncke, N. Collaert, C. Claeys, Wei Li
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引用次数: 2

Abstract

Deep level traps in lattice-matched In0.47Ga0.53As epitaxial layers grown by MBE on InP substrates have been studied by Deep Level Transient Spectroscopy (DLTS) on Al2O3/InGaAs Metal-Oxide-Semiconductor (MOS) capacitors. The impact of different surface passivation steps and a post-gate-deposition Forming Gas Annealing (FGA) has been studied. It is shown that spectra are dominated by a near mid gap electron trap in the depletion region, with activation energy in the range 0.37 eV to 0.42 eV. At the same time, a broad background distribution of interface states is found as well, which is significantly reduced by the FGA. Detailed carrier trapping studies have been carried out to identify the origin of the grown-in electron traps, which are shown to be of point defect behavior.
INP层INGAAS的深层次研究
在Al2O3/InGaAs金属氧化物半导体(MOS)电容器上,利用深能级瞬态光谱(DLTS)研究了MBE在InP衬底上生长的晶格匹配In0.47Ga0.53As外延层中的深能级陷阱。研究了不同表面钝化步骤和栅极后沉积成形气体退火(FGA)的影响。结果表明,在耗尽区,能谱以近中隙电子阱为主,活化能在0.37 ~ 0.42 eV之间。同时,发现界面状态具有广泛的背景分布,FGA大大减小了这种背景分布。详细的载流子捕获研究已经进行,以确定生长的电子陷阱的起源,显示出点缺陷行为。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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