Impact of deep submicron technology on dependability of VLSI circuits

C. Constantinescu
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引用次数: 197

Abstract

Advances in semiconductor technology have led to impressive performance gains of VLSI circuits, in general, and microprocessors, in particular. However, smaller transistor and interconnect dimensions, lower power voltages, and higher operating frequencies have contributed to increased rates of occurrence of transient and intermittent faults. We address the impact of deep submicron technology on permanent, transient and intermittent classes of faults, and discuss the main trends in circuit dependability. Two case studies exemplify this analysis. The first one deals with intermittent faults induced by manufacturing residuals. The second case study shows that transients generated by timing violations are capable of silently corrupting data. It is concluded that the semiconductor industry is approaching a new stage in the design and manufacturing of VLSI circuits. Fault-tolerance features, specific to custom designed computers, have to be integrated into commercial-off-the-shelf (COTS) VLSI systems in the future, in order to preserve data integrity and limit the impact of transient and intermittent faults.
深亚微米技术对超大规模集成电路可靠性的影响
半导体技术的进步使VLSI电路的性能得到了显著提高,尤其是微处理器。然而,更小的晶体管和互连尺寸、更低的电源电压和更高的工作频率导致瞬态和间歇性故障的发生率增加。我们讨论了深亚微米技术对永久性、暂态和间歇性故障的影响,并讨论了电路可靠性的主要趋势。两个案例研究证明了这一分析。第一种方法处理由制造残余引起的间歇故障。第二个案例研究表明,由时间冲突生成的瞬态能够静默地破坏数据。结论是,半导体工业在超大规模集成电路的设计和制造方面正在进入一个新的阶段。为了保持数据完整性并限制瞬态和间歇性故障的影响,未来必须将定制设计计算机的容错功能集成到商用现货(COTS) VLSI系统中。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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