Ultra-wideband hybrid substrate integrated ribbon waveguides using 3D printing

Abstract

A new wave guiding structure and fabrication technique is introduced for high speed, low loss, ultra-wideband interconnects. It is a hybrid between a dielectric ribbon and a substrate integrated waveguide design. In this structure, a high dielectric constant valued core is surrounded by a low dielectric constant valued cladding which in turn is surrounded by a metal layer. Both cylindrical and rectangular waveguide designs are presented. Simulation and measurement results show that ultra-wide band interconnects with low-dispersion can be designed using this hybrid approach. Fabrication of the cladding layer was carried out using 3D plastic printing. Simulated and measured results are discussed as well as fabrication techniques.