Characterizations of Silicon Carbide Whisker-Filled in Benzoxazine-Epoxy Shape Memory Polymers

Abstract

Shape memory polymers (SMPs) are polymer materials that can fix the temporary shape and then recover to their original permanent shape by external stimulation, i.e. applied heat. In this research, shape memory polymer composites (SMPCs) from benzoxazine (BA-a)-epoxy binary systems reinforced with adamantine silicon carbide whisker (SiCw) are investigated. The SiCw contents are controlled to be in range of 0 to 15% by weight. All specimens were fabricated by compression molding technique. The results revealed that the shape memory polymer composites showed higher glassy state storage modulus with increasing amount of the whisker suggesting substantial reinforcement effect of the whisker used. The glass transition temperature (Tg) was also improved from 102°C of the based polymer to the value about 122°C with the addition of about 15% by weight of the silicon carbide whisker. Finally, shape recovery stress systematically increased from the value about 1.5MPa of the unfilled polymer matrix to the value about 3.2MPa with an addition of 15% by weight of the silicon carbide whisker. The positive effect on thermal stability from SiCw addition is expected from the modification and will be reported in this work.