Peridynamic Solution of Wetness Equation with Time Dependent Saturated Concentration in ANSYS Framework

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Pub Date : 2017-08-03 DOI:10.1109/ECTC.2017.297

C. Diyaroglu, E. Madenci, S. Oterkus, E. Oterkus

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引用次数: 1

Abstract

The components of Integrated Circuit (IC) devices are susceptible to moisture absorption at different stages of the production environment which can lead to hygrothermal stresses during the surface mounting process. The moisture concentration in electronic packages can be determined based on the wetness approach. If the saturated concentration value is dependent on temperature or time, the analogy between the wetness equation and the standard diffusion equation is not valid and requires special treatment. In this study, an alternative formulation, peridynamics, is utilized for the solution of wetness field equation in the case of saturated concentration varying with time. The formulation is implemented in the commercial finite element software, ANSYS, by utilizing traditional finite elements and solvers to make the computations more efficient. The peridynamic wetness approach is validated by considering various problem cases for absorption and desorption with multi-material systems representative of electronic packages.

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ANSYS框架下饱和浓度随时间变化的湿度方程的周动力解

集成电路(IC)器件的组件在生产环境的不同阶段都容易受到吸湿的影响，这可能导致表面安装过程中的湿热应力。电子封装中的水分浓度可以通过湿度法来确定。如果饱和浓度值与温度或时间有关，则湿度方程与标准扩散方程的类比是无效的，需要进行特殊处理。在本研究中，在饱和浓度随时间变化的情况下，湿场方程的解采用了另一种形式，即周期动力学。该公式在商用有限元软件ANSYS中实现，利用传统的有限元和求解器，提高了计算效率。通过考虑以电子封装为代表的多材料系统的吸收和解吸的各种问题，验证了周动力湿度方法。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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