Yield Improvement and Cost of Test Reduction Via Automated Socket Cleaning

Abstract

Accurate testing of advanced devices using sockets is the primary method of assuring that the final assembled devices meet performance and reliability specifications. During any device test operation, contact is made with the device in a socket and, consequently, contamination from the package accumulates into the socket and onto the contactor surfaces. To maintain high yields during test operations, the sockets and contactors must be regularly cleaned. Modern production handlers are equipped for auto-contactor cleaning (ACC) functions to reduce downtime and maintain high throughput. In this paper, implementation of cleaning units used for in-situ cleaning execution are presented; and production test results are presented with an emphasis on the overall performance for the long-term cleaning effects and reduced total test time. A successful customer implementation shows the benefits of this approach within a high-volume testing environment.