Contactless characterization of MEMS devices using optical microscopy

A. Timár, G. Bognár
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引用次数: 3

Abstract

In this paper a new approach for measuring depth values of cavities of Micro-Electro Mechanical System (MEMS) is presented. This measurement was done by using a simple optical microscope and image processing techniques. The sample need not to be treated with any foreign material such as reflective or conductive coating.
MEMS器件的光学显微镜非接触式表征
提出了一种测量微机电系统(MEMS)空腔深度值的新方法。该测量是通过使用简单的光学显微镜和图像处理技术完成的。样品不需要处理任何外来物质,如反射或导电涂层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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