F. Eltes, J. Ortmann, P. Castera, D. Urbonas, D. Caimi, L. Czornomaz, P. Sanchis, J. Fompeyrine, S. Abel
{"title":"Silicon-Integrated High-Speed Modulators Based on Barium Titanate with Record-Large Pockels Coefficients","authors":"F. Eltes, J. Ortmann, P. Castera, D. Urbonas, D. Caimi, L. Czornomaz, P. Sanchis, J. Fompeyrine, S. Abel","doi":"10.1109/CLEOE-EQEC.2019.8872385","DOIUrl":null,"url":null,"abstract":"Integrated photonics is a key technology platform for optical communication, sensing, and data processing. Driven by the success of the CMOS industry and the resulting maturity of silicon-based fabrication methods, silicon photonics has evolved as an important candidate to realize integrated photonic circuits (PICs) in a cost-efficient and scalable way. Electrical control of the optical properties is critical in PICs: Fast electro-optical modulators are essential to reach high data rates, low-loss switches are needed to dynamically reconfigure networks, and low-power tuning elements are important to compensate temperature fluctuations. Traditionally, such components are implemented in silicon photonics by exploiting the plasma-dispersion effect [1] or Joule heating [2], which are, however, intrinsically linked with optical absorption or high power consumption. These challenges could be solved by using the Pockels effect as an electro-optic switching mechanism. However, because silicon lacks a Pockels effect, other materials with a non-vanishing Pockels effect need to be integrated on the technology platform.","PeriodicalId":6714,"journal":{"name":"2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)","volume":"8 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CLEOE-EQEC.2019.8872385","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Integrated photonics is a key technology platform for optical communication, sensing, and data processing. Driven by the success of the CMOS industry and the resulting maturity of silicon-based fabrication methods, silicon photonics has evolved as an important candidate to realize integrated photonic circuits (PICs) in a cost-efficient and scalable way. Electrical control of the optical properties is critical in PICs: Fast electro-optical modulators are essential to reach high data rates, low-loss switches are needed to dynamically reconfigure networks, and low-power tuning elements are important to compensate temperature fluctuations. Traditionally, such components are implemented in silicon photonics by exploiting the plasma-dispersion effect [1] or Joule heating [2], which are, however, intrinsically linked with optical absorption or high power consumption. These challenges could be solved by using the Pockels effect as an electro-optic switching mechanism. However, because silicon lacks a Pockels effect, other materials with a non-vanishing Pockels effect need to be integrated on the technology platform.