Interconnect Opportunities for Gigascale Integration

J. Meindl
{"title":"Interconnect Opportunities for Gigascale Integration","authors":"J. Meindl","doi":"10.1109/MM.2003.1209464","DOIUrl":null,"url":null,"abstract":"During the past decade, interconnects have replaced transistors as the dominant determiner of chip performance. To sustain the historical rate of advance in performance, monolithic interconnect technology has rapidly evolved to keep pace with advances in transistor density and performance. New and radically different interconnect technologies will become increasingly important to future gigascale microsystems.","PeriodicalId":13051,"journal":{"name":"IBM J. Res. Dev.","volume":"26 1","pages":"245-264"},"PeriodicalIF":0.0000,"publicationDate":"2002-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"303","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IBM J. Res. Dev.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MM.2003.1209464","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 303

Abstract

During the past decade, interconnects have replaced transistors as the dominant determiner of chip performance. To sustain the historical rate of advance in performance, monolithic interconnect technology has rapidly evolved to keep pace with advances in transistor density and performance. New and radically different interconnect technologies will become increasingly important to future gigascale microsystems.
千兆级集成的互连机会
在过去的十年中,互连已经取代晶体管成为芯片性能的主要决定因素。为了保持性能的历史进步速度,单片互连技术迅速发展,以跟上晶体管密度和性能的进步。新的和完全不同的互连技术对未来的千兆级微系统将变得越来越重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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